| MRC |
Requirement Statement |
Characteristics |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 SHIFT REGISTER, SERIAL IN, SERIAL OUT |
| CQZP |
INPUT CIRCUIT PATTERN |
3 INPUT |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND LOW POWER AND SCHOTTKY |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| AGAV |
III END ITEM IDENTIFICATION |
MD-1118/V1-G FSCM 80058 |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
60.0 MILLIWATTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
8 |
| ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
