| MRC |
Requirement Statement |
Characteristics |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
680.0 MILLIWATTS |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 PIN |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
30.0 VOLTS MAXIMUM POWER SOURCE |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 2 INPUT |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
A-1 MIL-M-38510 |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
80063-SM-A-949379 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| CZER |
MEMORY DEVICE TYPE |
ROM |
