MRC |
Requirement Statement |
Characteristics |
AFGA |
OPERATING TEMP RANGE |
-30.0 TO 75.0 DEG CELSIUS |
CQZP |
INPUT CIRCUIT PATTERN |
TRIPLE 3 INPUT |
CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
AFJQ |
STORAGE TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
ADAQ |
BODY LENGTH |
0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
AEHX |
MAXIMUM POWER DISSIPATION RATING |
105.0 MILLIWATTS |
ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND EXPANDABLE |
CSSL |
DESIGN FUNCTION AND QUANTITY |
3 TRANSLATOR, LEVEL |
CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
6.0 VOLTS MAXIMUM POWER SOURCE |
TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |