MRC |
Requirement Statement |
Characteristics |
CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
CQZP |
INPUT CIRCUIT PATTERN |
QUAD 2 INPUT |
CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
ADAQ |
BODY LENGTH |
0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
CZEQ |
TIME RATING PER CHACTERISTIC |
350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED |
CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CSSL |
DESIGN FUNCTION AND QUANTITY |
4 GATE, EXCLUSIVE NOR |