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5962-00-632-5205, 5962006325205 NSN Information

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Manufacturer Part Number(s):1820-0628, 1820-1028, 31013EB, 3101A, 351-7676-012, 35939644-00, 4250-0089, 51-P99967A402, 5189036, 57952500-01, 63A133445P18, 845588-1

FSC NIIN ITEM NAME
5962 006325205 MICROCIRCUIT,MEMORY
INC ESDC HMIC
4101 B N

5962-00-632-5205 MCRD (Master Cross Reference Data)

Mfg. Part # Mfg. Name CAGE RNCC RNVC ISC MSDS SADC DAC HCC
1820-0628 HEWLETT PACKARD CO 28480 5 9 3
1820-1028 HEWLETT PACKARD CO 28480 C 1 3 N
31013EB MILITARY SPECIFICATIONS 81349 C 1 3 N
3101A INTEL CORP 34649 C 1 3 N
351-7676-012 ROCKWELL COLLINS INC. 13499 3 2 3
35939644-00 LOCKHEED MARTIN CORP 08241 5 9 3
4250-0089 GENRAD INC 24655 C 1 3 N
51-P99967A402 MOTOROLA INC. 94990 C 1 3 N
5189036 NAVAL SEA SYSTEMS COMMAND 53711 C 1 3 N
57952500-01 GENERAL DYNAMICS INFORMATION SYSTEMS 27963 C 1 3 N
63A133445P18 LOCKHEED MARTIN CORPORATION 16331 C 1 3 N
845588-1 RAYTHEON COMPANY 49956 C 1 3 N
867489 DRS SIGNAL SOLUTIONS INC. 14632 C 1 3 N
AM3101/BEA ADVANCED MICRO DEVICES, INC. 34335 5 9 3
AM3101DM-B ADVANCED MICRO DEVICES, INC. 34335 5 1 3
C3101 ADVANCED MICRO DEVICES, INC. 34335 E 8 3
DEC7489 COMPAQ FEDERAL LLC 15476 5 9 3
DH5980 ADVANCED MICRO DEVICES, INC. 34335 5 9 3
DH75168 ADVANCED MICRO DEVICES, INC. 34335 E 8 3
DM5489J NATIONAL SEMICONDUCTOR CORPORATION 27014 5 9 3
DM5489J MILITARY SPECIFICATIONS 81349 5 9 3
DM5489J/883 NATIONAL SEMICONDUCTOR CORPORATION 27014 C 1 3 N
DM7489J NATIONAL SEMICONDUCTOR CORPORATION 27014 C 1 3 N
DM7489N TEXAS INSTRUMENTS INCORPORATED 01295 C 1 3 N
HL50807 FAIRCHILD SEMICONDUCTOR CORP 07263 5 9 3
HL50808 FAIRCHILD SEMICONDUCTOR CORP 07263 C 1 3 D
HRAM1-0064-012A INTERSIL CORPORATION 34371 5 9 3
HRAM1-0064-012B INTERSIL CORPORATION 34371 C 1 3
HRAM1-0064-2B INTERSIL CORPORATION 34371 5 2 3
IM5501CDE INTERSIL INC 32293 5 9 3
IM5501MDE-012A INTERSIL INC 32293 5 9 3
IM5501MDE-012B INTERSIL INC 32293 C 1 3
MCM4064L FREESCALE SEMICONDUCTOR INC. 04713 C 1 3 N
MIS-23639 U S ARMY AVIATION AND MISSILE 18876 E 8 3
P3101A INTEL CORP 34649 E 8 3
SC16111LH FREESCALE SEMICONDUCTOR INC. 04713 C 1 3
SC16112LH FREESCALE SEMICONDUCTOR INC. 04713 5 2 3
SD70334-012A NATIONAL SEMICONDUCTOR CORPORATION 27014 5 2 3
SD70334-012B NATIONAL SEMICONDUCTOR CORPORATION 27014 C 1 3
SN5489J TEXAS INSTRUMENTS INCORPORATED 01295 E 8 3
SN7489J NATIONAL SEMICONDUCTOR CORPORATION 27014 5 2 3
SNJ5489J TEXAS INSTRUMENTS INCORPORATED 01295 C 1 3 N

5962-00-632-5205 Characteristics

MRC Requirement Statement Characteristics
ADAQ BODY LENGTH 0.760 INCHES MINIMUM AND 0.785 INCHES MAXIMUM
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
CZEQ TIME RATING PER CHACTERISTIC 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND POSITIVE OUTPUTS AND W/ENABLE
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
CZZZ MEMORY CAPACITY UNKNOWN
CRHL (NON-CORE DATA) BIT QUANTITY 64
CWSG TERMINAL SURFACE TREATMENT SOLDER
AEHX MAXIMUM POWER DISSIPATION RATING 512.0 MILLIWATTS
CSWJ (NON-CORE DATA) WORD QUANTITY 16
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
TEST TEST DATA DOCUMENT 13499-351-7576 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS
AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS
ADAU BODY HEIGHT 0.200 INCHES MAXIMUM
CQZP INPUT CIRCUIT PATTERN 10 INPUT
CZER MEMORY DEVICE TYPE RAM
ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM