| MRC |
Requirement Statement |
Characteristics |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
200.0 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CQZP |
INPUT CIRCUIT PATTERN |
13 INPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
15.0 VOLTS MAXIMUM POWER SOURCE |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
4 |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| ADAU |
BODY HEIGHT |
0.070 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAQ |
BODY LENGTH |
1.150 INCHES MINIMUM AND 1.220 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
32 |
