MRC |
Requirement Statement |
Characteristics |
CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
CSSL |
DESIGN FUNCTION AND QUANTITY |
1 ENCODER, PRIORITY |
CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
TEST |
TEST DATA DOCUMENT |
99971-7537028 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
ADAQ |
BODY LENGTH |
0.371 INCHES MINIMUM AND 0.409 INCHES MAXIMUM |
CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE |
CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
ADAU |
BODY HEIGHT |
0.050 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
CQZP |
INPUT CIRCUIT PATTERN |
9 INPUT |
AEHX |
MAXIMUM POWER DISSIPATION RATING |
250.0 MILLIWATTS |
CZEQ |
TIME RATING PER CHACTERISTIC |
25.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
ADAT |
BODY WIDTH |
0.247 INCHES MINIMUM AND 0.283 INCHES MAXIMUM |