| MRC |
Requirement Statement |
Characteristics |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CQZP |
INPUT CIRCUIT PATTERN |
2 INPUT |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 BUFFER, INVERTING |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINALS GOLD |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 PIN |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM POWER AND MEDIUM SPEED |
| CQWX |
OUTPUT LOGIC FORM |
RESISTOR-TRANSISTOR LOGIC |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
4.0 VOLTS MAXIMUM POWER SOURCE |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
32.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 32.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
80.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| AFGA |
OPERATING TEMP RANGE |
0.0 TO 70.0 DEG CELSIUS |
