| MRC |
Requirement Statement |
Characteristics |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
10.0 VOLTS MAXIMUM POWER SOURCE |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
3 GATE, NAND |
| TTQY |
TERMINAL TYPE AND QUANTITY |
12 PIN |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
19.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
METAL |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAU |
BODY HEIGHT |
0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| ADAR |
BODY OUTSIDE DIAMETER |
0.357 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
7 INPUT |
| TEST |
TEST DATA DOCUMENT |
97942-128C365 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 175.0 DEG CELSIUS |
