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5962-00-008-5663, 5962000085663 NSN Information

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Manufacturer Part Number(s):1915008-1, MD2002MICROSYSDEVLAB, RM2002D

FSC NIIN ITEM NAME
5962 000085663 MICROCIRCUIT,LINEAR
INC ESDC HMIC
3177 B N

5962-00-008-5663 MCRD (Master Cross Reference Data)

Mfg. Part # Mfg. Name CAGE RNCC RNVC ISC MSDS SADC DAC HCC
1915008-1 HONEYWELL INTL INC 55972 5 9 2
1915008-1 HONEYWELL INTERNATIONAL INC. 96774 3 2 2
MD2002MICROSYSDEVLAB HONEYWELL INTL INC 55972 5 1 2
RM2002D RAYTHEON COMPANY 49956 5 9 2
RM2002D RAYTHEON TECHNICAL SERVICES COMPANY 3B150 3 2 2

5962-00-008-5663 Characteristics

MRC Requirement Statement Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AEHX MAXIMUM POWER DISSIPATION RATING 400.0 MILLIWATTS
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 40.0 VOLTS MAXIMUM POWER SOURCE
PRMT III PRECIOUS MATERIAL GOLD
TEST TEST DATA DOCUMENT 19315-1915008 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
CWSG TERMINAL SURFACE TREATMENT SOLDER
ADAQ BODY LENGTH 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM
ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND HIGH CURRENT AND HIGH VOLTAGE AND POSITIVE OUTPUTS AND EXPANDABLE
PMLC III PRECIOUS MATERIAL AND LOCATION TERMINAL SURFACE GOLD
CQSJ INCLOSURE MATERIAL CERAMIC
AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS
AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS
CSSL DESIGN FUNCTION AND QUANTITY 1 DRIVER, HIGH CURRENT
CQZP INPUT CIRCUIT PATTERN 7 INPUT
ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM
CZEQ TIME RATING PER CHACTERISTIC 900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL