| MRC |
Requirement Statement |
Characteristics |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQZP |
INPUT CIRCUIT PATTERN |
TRIPLE 3 INPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
3 GATE, NAND-NOR |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINALS GOLD |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
66.0 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| TEST |
TEST DATA DOCUMENT |
05869-717310-68 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 175.0 DEG CELSIUS |
