| MRC |
Requirement Statement |
Characteristics |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
0.1500 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
10.000 PICOFARADS SINGLE SECTION |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CRHD |
TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS |
-30.0 TO 30.0 SINGLE SECTION |
| ADAT |
BODY WIDTH |
0.035 INCHES NOMINAL |
| CWJK |
CASE MATERIAL |
CERAMIC |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
200.0 DC SINGLE SECTION |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| CQLZ |
TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS |
0.0 SINGLE SECTION |
| CRTP |
TOLERANCE RANGE PER SECTION |
-5.00 TO 5.00 PERCENT SINGLE SECTION |
| ADAQ |
BODY LENGTH |
0.075 INCHES NOMINAL |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| AAQL |
BODY STYLE |
CHIP TYPE |
| ADAU |
BODY HEIGHT |
0.040 INCHES MAXIMUM |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
100000.0 MEGOHMS |
